Research highlights from Fraunhofer IIS/EAS

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Robust electronics for the vehicles of tomorrow


Safe design of persistent and reliable semiconductor components

A large part of automotive innovation is based on high-performance electronics. The components that are available for this today have been developed for consumer goods. They can only withstand the harsh operating conditions and environmental influences they are exposed to in cars to a limited extent.

Fraunhofer IIS/EAS is working on developing semiconductor components in such a way that they can be used in vehicle systems with long lifecycles and functions that are crucial to safety. The basis for this are predictive models for various aging and wear processes as well as software for the calculation of reliability.

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Automated and reliable analog design


Intelligent IP design flow

Today, ICs are only designed efficiently by means of software. But this automation is hardly possible for analog components on chips. The consequence is disproportional big effort as well as high development costs and risks.

Therefore, Fraunhofer IIS/EAS developed the »Intelligent IP design flow« – a solution with an unparalleled degree of automation for the analog design. On the basis of an intelligent IP library, this design flow enables a remarkable faster and more reliable development with reusable design results.

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Microchips in the third dimension


Innovative »More than Moore« technologies

Traditional chip layouts increasingly reach their limits. For many applications, components have to be laid out even more compactly and with even higher performance than is customary today. For this reason the future belongs to three-dimensionally designed microchips.

Fraunhofer IIS/EAS has developed a particularly high-performance and especially small 3D chip, by means of which the data transmission can reach a bandwidth of up to 400 gigabit per second. To achieve this, the chip is equipped with a processor and a memory unit that are arranged on a substrate so that especially short line paths are created and an effective heat dissipation is enabled.


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Image processing system with privacy protection

Intelligente image sensor system-on-chip

Researchers at Fraunhofer IIS/EAS have developed an image processing system that detects positions and movement patterns, and automatically attributes these to people or objects.

The key to the solution is an image sensor system-on-chip with integrated data processing. High-performance algorithms ensure that the system not only detects whether and where objects are precise to location and time. It also learns to differentiate between various activities. Furthermore, there is no output of real image data, whereby the privacy of persons is protected.

© Fraunhofer IIS/EAS, Foto: Oliver Killig

Smart sensors for Industry 4.0


Affordable wireless sensor systems for real time communication

Interconnected, intelligent sensors are the key components for using modern information and communications technologies in industry. For the conditions of a production plant, however, special robust systems are required, which are equipped with components that record and communicate parameters simultaneously.

In the »RoMulus« project, methods are being developed to realize such multi-sensor systems efficiently and for the specific use, while also permitting production in small piece numbers. Here, Fraunhofer IIS/EAS places special focus on affordable wireless sensor systems for real time communication.

© Fraunhofer IIS/EAS, Foto: Oliver Killig

Acoustic condition monitoring in production

Infrasonics, airborne sound and ultrasound for condition monitoring

Today, a large variety of sensor information is already utilized for condition monitoring in production. A particularly promising and flexible approach is the acoustic event recognition, which has only been available in expensive special solutions up to now.

Fraunhofer IIS/EAS, together with its partners, is therefore developing an easy-to-use, flexible and affordable platform with autonomous energy supply for acoustic monitoring in industrial applications. The aim is to utilize infrasonics, airborne sound and ultrasound for multi-faceted tasks. The basis for this are new kinds of self-learning sensor systems.